The Boson camera core represents the best in FLIR high-performance uncooled thermal imaging technology inside a small, lightweight, and low-power package, and now the company’s partners and customers will have the option to buy radiometric versions that can capture the temperature data of each pixel in the scene.
The new radiometric camera core comes in two versions, 640 x 512 or 320 x 256 resolutions with multiple lens configurations and the capability to capture temperature data for quantitative assessment. The camera core is intended for employment in systems over a mixture of applications, including firefighting, unmanned systems, surveillance, security, industrial inspection, and fixed-asset monitoring.
Offering radiometric accuracy provides ±5C (±8F) or ±5% temperature measurement accuracy, the cameras include a Spot Meter Accuracy software feature providing an assessment of how accurate a particular temperature measurement appears in the scene. Offered as telemetry data obtained through the Boson SDK or the Boson GUI, this feature gives guidance across five confidence grades providing in-the-moment assessment to improve temperature measurement confidence.
Also, the Spot Meter Accuracy software feature provides operators with the capability to account for dynamic ambient temperatures, as well as the ability to configure measurements before operation, including adjusting emissivity and thermal gain settings. These functions are essential for outdoor environments and the swift movements of unmanned aerial drones and automated ground vehicles. The software also provides inspection and assessment features, including spot meters and windows that pinpoint temperature measurement in the scene that the camera is focused on and atmospheric correction capabilities through post-processing analysis.
All Boson cores feature the company’s infrared video processing architecture, noise reduction filters, and local-area contrast. The imaging processing capabilities include industry-standard communication interfaces, comprising visible CMOS and USB.